Components for material deposition

High rate and uniform material distribution

One of the most important characteristics determining the quality of the finished product is the degree of uniformity and repeatability of the thin-film layers that have been applied. Coupled with this, the machine and its components should allow high material deposition rates to cope with constantly increasing demands on quality and productivity. BühlerLeybold Optics designs and manufactures high-end components to meet such demands.

Bühler Leybold Optics evaporators

Thermal resistance evaporators
For many ophthalmic processes, thermal evaporation using boat-type resistive sources is crucial. Bühler Leybold Optics offers a wide variety of models featuring different numbers as well as volumes of boats. The ingenious modular concepts of the SYRUS series and LEYBOLD OPTICS ACE series box coating systems allow for maximum flexibility in terms of positioning and choice of models. In combination with the appropriate electron-beam and plasma sources, the optimum equipment configuration can be realized for every application.

Electron-beam guns
Based on decades of experience in thin-film technology and electron-beam guns, Leybold Optics has developed the LEYBOLD OPTICS HPE series of electron-beam guns. This series is used for the evaporation of a very large range of coating materials, such as oxides, fluorides, metals and sulfides. The HPE technology is mainly used in box coaters and in the optics, electronics and optoelectronics fields.

Sputter sources
Through usage of sputter deposition technology substrates can be coated with high deposition rates under high vacuum conditions with thin films of materials like metals, oxides and already oxidized metals. In cases where very dense layers, special material compositions or layers with low losses are required, the sputter technology will be the perfect choice. BühlerLeybold Optics offers the entire spectrum from single to dual magnetron arrangements, from planar target setups to rotatable ones as well as from DC sputtering via MF sputtering to RF sputtering.


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