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Wafer block cutter

Franz Haas AWDM

The Franz Haas AWDM wafer block cutter cuts wafer blocks into smaller wafer fingers.

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Key benefits

Efficient cutting

In fully automatic operation, the wafer block cutter performs up to 14 cuts per minute.

Various formats

Change the cutting frames to cut your products into different sizes using wires or blades.

Hygienic production

The stainless steel execution of the wafer block cutter ensures highest hygienic standards. The Franz Haas AWDM is easily accessible to simplify cleaning. Monitor the production process through the polycarbonate cover.

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How it works

Bringing wafer blocks into their final form

A rope conveyor feeds the cooled wafer blocks into the cutter. Pushers move them through two cutting frames arranged at a 90° angle. The distances between the cutting wires or blades is variable.

Key topics

Billions of people come into contact with Bühler technologies to cover their basic needs for food and mobility every day. Our motto is creating “innovations for a better world.” Find out more about our key topics.

Application possibilities

The Bühler process

Efficient in every step of production

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