Vacuum coater for micro- and optoelectronics
LEYBOLD OPTICS LTE series
The Leybold Optics LTE series is the long throw evaporation solution for designing structured features with nanometer scales to couple with the lift-off process and especially engineered for semiconductor applications and R&D.
Key benefits
Optimal coating quality
High-precision coatings on structured wafers without shadow effect for superior manufacturing outcomes to achieve high-level 3D coatings.
Service and expertise
The Leybold Optics LTE series benefits from 150 years of expertise from a leading thin-film company with service available worldwide.
Flexibility
Evaporation of different materials, including metals (metal lift-off) and oxides, different wafer sizes (from 1 to 6 inch, 8 and 12 inch on request) and capacity to manage high material volumes. Our solution is fully customizable and flexible.
Highlight features
Advanced Long Throw Evaporation Technology
Optimal Chamber Design for Enhanced Substrate Processing
Experience cutting-edge evaporation technology with our uniquely designed system featuring a source-to-dome distance of 1.3 meters, allowing for long throw evaporation. Our adaptable dome precisely caters up to 6x 150 mm diameter substrates with an option for 200 mm capacity upon request, ensuring versatility and superior coverage for your high-precision manufacturing needs.
Enhanced Coating Performance
Synergy of Electron-Beam and Plasma Sources in PIAD Applications
Uniting an electron-beam gun with a plasma source, our advanced process innovation for Plasma-Impulse Atomic Deposition (PIAD) improves thin-film quality and adhesion. This combination results in precise thickness control and expanded material capabilities.
Precision Perpendicular Deposition System
Engineered for Directional Coating Excellence
Our designed deposition system introduces a state-of-the-art dome constructed to achieve nearly perpendicular deposition angles, ensuring directional coatings of the highest precision. This innovative approach provides unparalleled uniformity and quality in thin-film applications, setting a new standard for accuracy and performance in the industry.
Lift-off process
Metallization process
- Physical vapor deposition (PVD)
- Coating with photoresist
- Patterned thin-film deposition
- Metal lift-off
Before lift-off
After lift-off
More information
Services & trainings
Our training and services are designed to keep you up to date on our products and technologies, giving you the confidence and experience you need.
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How can we help?
Sales Manager Semiconductor
Daniel Sa Pereira
daniel.sa_pereira@buhlergroup.com
+49 6023 500 0
Siemensstrasse 88
Alzenau, Germany
63755
