Leybold Optics IBT 800 是一种生产效率出众的解决方案，它通过自动搬运、批处理和双预抽腔体来对晶圆进行高精度整平和修调。
Our ion beam source can be used from feature trimming to bulk removal of materials used in surface acoustic wave (SAW) or bulk acoustic wave (BAW) filters such as the frequency adjustment/surface treatment of piezoelectric materials (e.g. LiNbO3 or LiTaO3), trimming down oxides (e.g. SiO2) for temperature compensation (TC-SAW) or thickness adjustment of nitrides (e.g. Si3N4).
The Leybold Optics IBT 800 smooths silicon wafers for wafer bonding. Insufficient chemical-mechanical polishing (CMP) might lead to surface or thin film deviations which need to be further planarized or trimmed towards a final thickness before wafer-to-wafer bonding can be processed. So the Leybold Optics IBT 800 can address high-level wafer planarization of surfaces and/or adjust the thin film thicknesses, making them ready for bonding.
IBT 800 集布勒在离子束表面校型专业技术上的大成，可配备一个 80 mm RF80 或 40 mm RF40 的离子源，去除率分别可达 0.6 或 0.15 mm3/cm。可搭配 ISERM 使用，而 ISERM 可在不破坏真空度的情况下，几秒内即确定离子源刻蚀率。
When moving workpieces in cassettes on roller conveyers, the IBT 800 is capable of processing batches of multiple wafers, optimising total times and reducing the cost of ownership. Substrate carriers each carrying up to 2x12’’, 3x 8’’, 4x 6’’ or 8x 4’’ wafers are available. Others on request.
这种大批量解决方案是一套适用于洁净室 (ISO5) 的机器人系统，能在基片架和晶圆盒之间自动取放晶圆，减少了因操作员接触晶圆而导致的影响。
由于集成了 OTFP，可在单一系统中结合工艺与 Metrology 量测设备来确定介电薄膜厚度。可使用波长 200-1100nm 和厚度范围为 50nm-50µm 的光谱仪来测量半透明层与半导体。
基片架晶圆盒采用带电动升降的垂直双槽设计，借助平行加工缩短操作时间。
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Ion Beam Trimming Sales Manager
christian.schindler@buhlergroup.com
+49 172 8099 329
Wollkämmereistraße 2
04357
Leipzig
Germany
