Header product
Vacuum coater for micro- and optoelectronics

LEYBOLD OPTICS LTE series

The Leybold Optics LTE series is the long throw evaporation solution for designing structured features with nanometer scales to couple with the lift-off process and especially engineered for semiconductor applications and R&D.

Header product

Key benefits

Optimal coating quality
High-precision coatings on structured wafers without shadow effect for superior manufacturing outcomes to achieve high-level 3D coatings.
Service and expertise

The Leybold Optics LTE series benefits from 150 years of expertise from a leading thin-film company with service available worldwide.

Flexibility
Evaporation of different materials, including metals (metal lift-off) and oxides, different wafer sizes (from 1 to 6 inch, 8 and 12 inch on request) and capacity to manage high material volumes. Our solution is fully customizable and flexible.

​​Highlight features​

Advanced Long Throw Evaporation Technology​

​​Optimal Chamber Design for Enhanced Substrate Processing​

Experience cutting-edge evaporation technology with our uniquely designed system featuring a source-to-dome distance of 1.3 meters, allowing for long throw evaporation. Our adaptable dome precisely caters up to 6x 150 mm diameter substrates with an option for 200 mm capacity upon request, ensuring versatility and superior coverage for your high-precision manufacturing needs.

​​Enhanced Coating Performance​

Synergy of Electron-Beam and Plasma Sources in PIAD Applications

Uniting an electron-beam gun with a plasma source, our advanced process innovation for Plasma-Impulse Atomic Deposition (PIAD) improves thin-film quality and adhesion. This combination results in precise thickness control and expanded material capabilities.

Precision Perpendicular Deposition System

Engineered for Directional Coating Excellence

Our designed deposition system introduces a state-of-the-art dome constructed to achieve nearly perpendicular deposition angles, ensuring directional coatings of the highest precision. This innovative approach provides unparalleled uniformity and quality in thin-film applications, setting a new standard for accuracy and performance in the industry.

Lift-off process

Metallization process

  1. Physical vapor deposition (PVD)
  2. Coating with photoresist
  3. Patterned thin-film deposition
  4. Metal lift-off

Before lift-off

After lift-off

Related products

No Results Found
Content Block

How can we help?

Sales Manager Semiconductor

Daniel Sa Pereira


daniel.sa_pereira@buhlergroup.com

+49 6023 500 0

Siemensstrasse 88
Alzenau, Germany
63755